PVD is the deposition of a layer (usually metal) on a substrate, from a source. The material is removed from a solid source and transported to a substrate, where is deposited.This is the schematics of the main processes that take place in PVD:

The characteristics of PVD that distinguishes it from CVD are:

1. physical mechanisms are used to remove atoms from source
2. solid source, not gaseous are used
3. no reactions take place at the substrate or in gas-phase (reactive PVD is an exception)

Hybrid processes (physical and chemical processes take place in the reactor) are preferred sometimes, because they have all the advantages.

Main types of PVD are:

• Evaporation (of the source)
• Sputtering (of the source)