My Courses:
Techonolgy of microelectronic devices
Substrate preparation
Film deposition
Modifying the film properties
Lithography
Tutorials
(
2
)
Photolithography
Advanced lithography
Etching
Fabricating devices
Photolithography
tutorial
Modules
1.
Optical sources
2. Photoresists
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Hard bake
- done on hot plate as the other bakes at a higher temperature of 120-140
o
C and for a longer time of 15 minutes
Harden resist
against etching, bombardment
If the baking takes time for
too long
, then the
resist profile can be changed
, which is not desired
Inspection
Find Defects before Etching or Implanting
with an optical microscope as seen in the picture below
Check if there were development problems such as:
Underdevelop
- the resist has low contrast and the dose was not sufficient -
solution
: increase dose
Incomplete develop
- the resist is
not completely removed
-
solution
: increase develop time
Severe overdevelop
- there was
too much resist removed
due to a too large develop or exposure time
The resist is removed when is not needed anymore by
wet or dry etching
1.
Optical sources
2. Photoresists
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