Soft bake - on hot plate, as shown in the pictures below

• has the purpose of evaporating most of the solvent
• If the baking time is too short, then the solvent is not sufficiently evaporated, causing problems with exposure and developing
•  If the baking time is too long, then the PAC is activated without exposure
• Temperature = 90oC

                     

 

Exposure - treated in optical sources module

• Transfers the mask image to the resist-coated wafer
• Activates photo-sensitive components of photoresist