Applying the photoresist - you can see in the picture below how photoresist is applied
the wafer is placed on a holder and kept there with the help of vacuum created between the holder and wafer
the photoresist is dispensed (5 ml) with a nozzle situated at a few cm over the center of the wafer, while the wafer is rotated with a low speed (500 rpm)
the dispenser is removed and a motor will spin the wafer at high velocities (3000 to 5000 rpm)
the excess resist is removed and a uniform film coating is obtained, while the solvent is evaporated
Substrate preparation
