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Photolithography tutorial

Modules

1. Optical sources
2. Photoresists

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  • Post-exposure bake
    • Completely remove the solvent before developing
    • Temperature of hot plate = 110 -120oC

  • Develop - the resist is removed by the developer in the exposed/unexposed regions for positive/negative lithography
    • 3 methods:
      • Puddle (as applying the photoresist) and rinsing with water
      • Spraying the developer + water rinse
      • Immersing the substrate in developer + water rinse (as shown in the picture below)

                       

1. Optical sources
2. Photoresists

pages: previous | 1 2 3 4 5 [6] 7 8 9 | next

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