Provide EMI and ESD protection on all interconnects and I/O. this includes front panel display indicators and controls, I/O interconnects, power cords, blank adapter brackets, peripheral drive cover plates, interface devices, and the like.
Locate drivers and control logic as close to the I/O connector as possible to minimize trace length and RF coupling of both common- and differential-mode currents. Place filtering components between control logic and the I/O connector.
Isolate noisy and quiet areas through use of a partition or moat. A moat is an absence of copper an all layers-power, ground, and signal. Connection between the moated areas is accomplished using common-mode chokes (data line filters), isolation transformers, or a bridge. Route only those associated with this quiet area through the bridge or data line filters. Ground both ends of the bridge (if possible when using multipoint grounding) to chassis ground with a screw or equivalent means. Grounding removes high-frequency RF currents present on the power planes due to RF ground noise generated by voltage gradients between partitioned sections.
Use data line filters, ferrite devices, or isolation transformers for connection between noisy and quiet areas.
Use capacitive and/or inductive data line filtering (capacitive for differential-mode, inductors for common/mode) on each and every I/O line. Place these components as close to the I/O connector as possible. Determine if the interwinding capacitance of inductors and data line filters will cause signal functionallity problems and degradation.
Schematic design of PCB projects 
