Based on this task the students shall be able to understand some specific topics of advanced PCB design and to have a global engineering view and professional skills regarding real projects.
Strongly based on practical engineering aspects, the task offers a basic background for a future design and research activity in electronics engineering and CAE-CAD-CAM area for development of printed circuit boards. Due to the tremendous increase in the use of electronic devices, ensuring Electromagnetic
Compatibility (EMC) of a printed circuit board in its early design phase is becoming one of the major technical issues.
Electromagnetic problems occur either when integrating electronic devices in their operating environment (cross-coupling, interference) or when dealing with the related EMC regulations (simulation of radiating phenomena due to Common-Mode currents induced on attached cables). As digital devices become smaller and perform at greater speeds, their emissions increase, making a thorough understanding of Electromagnetic Interference (EMI) essential for everyone in electrical engineering and PCB design today.
In high-speed designs, signal integrity (SI) has become a critical issue, and is posing increasing challenges to the PCB design engineers. Many signal integrity problems are electromagnetic phenomena in nature and hence related to the EMI/EMC topics. The term Signal Integrity (SI) addresses two concerns in the electrical design aspects – the timing and the quality of the signal. Does the signal reach its destination when it is supposed to? And also, when it gets there, is it in good condition? The goal of signal integrity analysis at board level is to ensure reliable data transmission from generators to receivers.
- Passive Electronic Components and Structures
- Active Electronic Components and Devices
- PCB and CAD for PCB Design
- Basics of Electronic Packaging
- Basics of Signal Integrity and Electromagnetic Compatibility |
Schematic design of PCB projects 
