In this tutorial, four parts will be discussed:

• the materials used for substrates
• the required properties for the substrates 
• one method of fabricating silicon wafers
• standard cleaning of the wafers

Wafers are the support and sometimes the first layer for devices. The whole wafer is processed, devices are fabricated on the wafer and at the end the wafer will be cut (for example to separate the ICs), as it can be seen in the picture. Then the devices will be packaged and used for the specific application.