another method of making structures by removing parts form a deposited film
the name of the method comes from the fact that the undesired part of the layer is lifted off from the substrate by removing the underlying photoresist
thus the etchant does not attack the film, only the photoresist
being left without the support of the photoresist the film is also removed
the main process steps in lift-off are presented below
Application: GaAs
advantages:
simple method, does not require etchant
no damage
disadvantage:
cannot be used for making small structures
good only for simple patterns
surface topology has to be smooth - poor step coverage metal deposition
Substrate preparation
