The aim of the design of a thick film circuit is to select the suitable materials, determine the layout of the different layers and construct the circuit package to meet the electrical requirements of the circuit, taking into consideration that the layout will be realized by using the screen printing and laser trimming processes.

 

Other processing steps and aspects, which should be considered as well, are as follows: firing, assembling, soldering, encapsulation, thermal management and the final mounting of the circuit module to an electronic system.

 

This module provides the basic design rules for thick film circuit and resistor layout determination.